Process Machine Interaction PMI Modeling and Monitoring of Chemical Mechanical Planarization CMP Process Using Wireless Vibration Sensors
IEEE Transactions on Semiconductor Manufacturing, Vol. 27, No. 1, Şubat 2014, s. 1-15, ISSN: 0894-6507
PRAHALAD K RAO,M BRİJ BHUSHAN,BUKKAPATNAM SATİSH T,KONG ZHENYU,BYALAL SANJAY,BEYCA ÖMER FARUK,FİELDS ADAM,KOMANDURİ RANGA