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Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, Vol. 14, No. 11, Ocak 2025, ISSN: 2162-8769

PARK JUNGHYUN,AGBADAN IGNACE,DAUDA MONSURU,BELLO MUSTAPHA,HENDERSHOT JOHN,TASNİM SOUNDARZO,ODUYEBO OMOTOLANİ,PARK SUNGGOOK,ENGLER ANTHONY,WİLLİAMSON JAİMAL,MATHEW VARUGHESE,ORAL ÇİĞDEM,FLAKE JOHN

Çiğdem Oral Özgün Makale oxidation multichip package polymer-metal adhesion metal interlayer cladding coupling agent Chip-to-chip (C2C) interconnect

Damage to sub half micron metal oxide silicon field effect transistor from plasma processing of low k polymer interlayer dielectrics

Semiconductor Science and Technology, Nisan 1998

TRABZON LEVENT,AWADELKARİM OSAMA

Levent Trabzon Özgün Makale

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