Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, Vol. 14, No. 11, Ocak 2025, ISSN: 2162-8769
PARK JUNGHYUN,AGBADAN IGNACE,DAUDA MONSURU,BELLO MUSTAPHA,HENDERSHOT JOHN,TASNİM SOUNDARZO,ODUYEBO OMOTOLANİ,PARK SUNGGOOK,ENGLER ANTHONY,WİLLİAMSON JAİMAL,MATHEW VARUGHESE,ORAL ÇİĞDEM,FLAKE JOHN